Sonda termica

KSD -75℃～+200℃

Supporta il riscaldamento e il raffreddamento rapido da temperature estremamente basse a temperature elevate. La velocità massima può raggiungere i 50°C/min. È in grado di controllare accuratamente la temperatura e l'errore è solitamente compreso entro +0,2℃.

Applied to chip R&D: Verify the performance of the chip at different temperatures during the chip design phase;
Quality control: Conduct reliability tests during chip production to ensure that the product meets the standards;
Failure analysis: Analyze the effective mode of the chip at extreme temperatures through high and low temperature tests.

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Cooling Capacity -40℃@600W

Heating cooling rate Up to 75℃/min

Temperature Accuracy ±0.2℃

Temperature monitoring type T type/K type/PT100

KSD SERIES

-75°C

più basso

200°C

Il più alto

±0.2℃

Precisione del controllo della temperatura

Modello		KSD-705	KSD-705PULS	KSD-710
Temperatura. Intervallo		-70℃~200℃	-75℃~200℃	-75℃~200℃
Capacità di raffreddamento	0℃	800w	1000w	2000w
	-40℃	500w	800w	1500w
	-55℃	300w	450w	900w
Test probe specifications		75*75mm	75*75mm	120*120mm
Temperature control point location		Plunger surface temperature	Plunger surface temperature	Plunger surface temperature
Control panel		7-inch touch screen	7-inch touch screen	7-inch touch screen
Controllore		PLC	Plc	Plc
Alimentazione		200v~230v 50hz/60hz
Product Dimension		465600365	500600400	550750550

CDA requirements

Equipped with LNEYA Dryer gas dryer series

Force adjustment for test specimen

Equipped with Z-axis pneumatic actuator

Comunicazione

Madbus RTU /TCP 、Prfibus DP 、CAN 、Rrofinet

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Features of Thermal Probe

The test head is designed with a dry gas channel layout to provide low dew point gas to the equipment, which can keep the DUT and test head in a stable dry environment without condensation or freezing.

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Application of Thermal Probe

The sensor is installed on the plunger module, which provides more timely and accurate temperature response.

The plunger module can be customized for easy disassembly and assembly.

The device is equipped with an external sensor receiving port that can directly measure the measured object. Switching to workpiece mode allows for direct control of the temperature of the tested component.

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