In the semiconductor industry, a diffusion furnace is a device used to manufacture doping layers on the surface of semiconductor materials. It achieves the doping process through high-temperature heating and controlled diffusion atmosphere. The diffusion furnace uses high-temperature heating to transfer dopants into the semiconductor crystal. Under high temperature conditions, dopant atoms have sufficient energy and activity to diffuse on the crystal surface. Diffusion furnaces usually use the atmosphere method to control the diffusion process. In a diffusion furnace, the transport and diffusion rate of dopants can be controlled by inputting different atmosphere gases.

Gas phase diffusion requires precise control of the concentration, temperature, and time of the diffusion gas to ensure the accuracy and uniformity of doping. Diffusion furnaces are usually equipped with temperature control systems, gas flow control systems, and diffusion control systems to achieve precise control of the diffusion process.

The diffusion furnace equipment usually consists of four main parts: heating chamber, atmosphere control system, temperature control system, and control system. Temperature control system: The temperature control system is used to precisely control the temperature of the heating chamber. Usually, methods such as thermocouples or radiation heaters are used to measure and regulate temperature. Control system: Diffusion furnace equipment is usually equipped with a control system to automatically control various parameters of the diffusion process, such as temperature, time, flow rate, etc. The control system can choose a human-machine interface, making operation more convenient and intuitive.

Diffusion furnaces are widely used in semiconductor processes, including the manufacturing of transistors, diodes, and solar cells. In addition, diffusion furnaces are also applied in fields such as glass industry and ceramic industry.

Air cooling chiller; Water cooling chiller

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Il sistema di controllo della temperatura di prova dei wafer può fornire ambienti ad alta e bassa temperatura per uso sperimentale. Tuttavia, essendo uno strumento, il suo funzionamento deve seguire alcune precauzioni. Questo articolo presenterà in dettaglio le precauzioni operative del sistema di controllo della temperatura dei wafer per garantire l'accuratezza e la sicurezza dell'esperimento.

Il sistema di controllo della temperatura di prova dei wafer è costituito principalmente da un sistema di refrigerazione, un sistema di riscaldamento, un sistema di controllo e un sensore di temperatura. Può ottenere un controllo accurato degli ambienti ad alta e bassa temperatura regolando i parametri del sistema di riscaldamento e del sistema di refrigerazione.

Prima di utilizzare il wafer per testare il sistema di controllo della temperatura, è necessario effettuare una serie di controlli. Verificare se il collegamento di alimentazione del dispositivo è normale e se la spina di alimentazione è ben salda. In secondo luogo, è necessario verificare se le connessioni delle tubazioni dell'apparecchiatura sono strette e se ci sono perdite. Inoltre, è necessario controllare la pulizia interna dell'apparecchiatura per garantire l'accuratezza dei risultati sperimentali.

Quando si utilizza il sistema di controllo della temperatura dei wafer, è necessario prestare attenzione ai seguenti suggerimenti. Evitare di muovere o inclinare l'apparecchiatura mentre è in funzione per evitare inutili lesioni. In secondo luogo, assicurarsi che i campioni sperimentali siano posizionati in modo sicuro e che non siano collocati sul bordo o sulle parti scorrevoli dell'apparecchiatura per evitare di cadere e danneggiare l'apparecchiatura o causare lesioni personali.

Quando si imposta la temperatura, regolarla gradualmente e prestare sempre attenzione alla differenza tra la temperatura visualizzata dal dispositivo e la temperatura impostata. Se la differenza è troppo grande, è necessario regolare per tempo i parametri del sistema di riscaldamento e del sistema di refrigerazione. Allo stesso tempo, è necessario mantenere l'apparecchiatura pulita e pulire regolarmente il condensatore, l'evaporatore e altri componenti per garantire la dissipazione del calore e l'effetto di raffreddamento dell'apparecchiatura.

L'uso prolungato del sistema di controllo della temperatura dei wafer può provocare un deterioramento delle prestazioni o un guasto dell'apparecchiatura. Pertanto, è necessario ispezionare e mantenere regolarmente l'apparecchiatura per individuare e risolvere i problemi in modo tempestivo. Allo stesso tempo, il filtro, l'olio e gli altri accessori dell'apparecchiatura devono essere sostituiti regolarmente secondo le istruzioni dell'apparecchiatura per garantire il normale funzionamento dell'apparecchiatura.

In breve, il funzionamento del sistema di controllo della temperatura dei wafer richiede l'attenzione a molti aspetti. Durante l'uso, è necessario attenersi rigorosamente alle procedure operative dell'apparecchiatura e prestare sempre attenzione allo stato di funzionamento dell'apparecchiatura e alle variazioni dei risultati sperimentali. Allo stesso tempo, è necessario prestare attenzione ai suggerimenti e alle precauzioni di manutenzione delle apparecchiature per garantire l'accuratezza e la sicurezza dell'esperimento.

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The wafer thin film deposition temperature control equipment chiller is an equipment used for cooling and heating temperature control testing in the component semiconductor manufacturing industry. So what should you pay attention to when using the environment?

1.Power distribution requirements for chiller unit of wafer thin film deposition temperature control equipment:

• Main power supply voltage: Within the rated voltage requirements, when the main power supply voltage fluctuation exceeds the specified range, the component high and low temperature testing machine chiller is not allowed to be started, otherwise it will be regarded as improper operation, and the damage caused thereby is not within the scope of our company’s maintenance. The water flow switch, water pump, cooling tower motor and other interlocking circuits of the water system can be correctly connected to the unit control circuit when necessary.

• The chiller unit of the wafer thin film deposition temperature control equipment is equipped with various measures and control circuits such as current overload protection, high and low pressure protection at the compressor exhaust end, motor coil overheating protection, anti-icing protection, cooling water flow chain protection, etc. The control circuit of the chiller group of LNEYA’s wafer thin film deposition temperature control equipment has been installed and debugged in the factory. Do not make any unauthorized changes. If you need to make any changes, please contact the technical department.

2.The following matters should be noted during installation:

• When lifting and installing the wafer thin film deposition temperature control equipment chiller, be careful not to damage the unit, and arrange the surrounding space reasonably to facilitate the maintenance of the wafer thin film deposition temperature control equipment chiller.

• According to the requirements for piping system design and construction and installation, the frozen water and cooling water system should be reasonably designed and installed to give full play to the chiller performance of the wafer thin film deposition temperature control equipment. It should be placed horizontally and installed in a ventilated position. For unit piping, please refer to the LNEYA product manual for recommended installation and construction.

When the environment around the water source and radiator tower is harsh, the chilled water and cooling water circuits must be installed with Y-type filters and cleaned regularly. An automatic exhaust valve must be installed at the top of the closed chilled water system, and a

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The power management chip temperature test system is an important equipment used to test the performance and reliability of semiconductor chips in different temperature environments. When purchasing this type of test equipment, you need to consider the following points:

• Temperature range: According to the test requirements, determine the temperature range required for testing. The power management chip temperature test system should be able to provide stable temperature control within a certain range to ensure the accuracy and repeatability of test results.
• Test sample size: Consider the size and shape of the semiconductor chip to be tested to ensure that the test sample can be installed correctly into the testing machine and will not be affected by mechanical stress or overheating.
• Temperature stability: The temperature stability of the power management chip temperature test system has a great impact on its test results. A testing machine that can maintain a stable temperature within the required temperature range should be selected to ensure the reliability of the test results.
• Heating and cooling speed: Heating and cooling speed will affect test efficiency, especially for tests that require rapid temperature changes. Choosing a testing machine with rapid heating and cooling capabilities can shorten testing time and improve work efficiency.
• Temperature uniformity: The temperature at various locations inside the testing machine should be as uniform as possible to ensure that all test samples are tested under the same temperature conditions. This will help obtain accurate test results and avoid poor repeatability of test results due to uneven temperatures.
• Control system: Choose the power management chip temperature test system of Guanya Refrigeration Control System to ensure accurate temperature control and real-time monitoring of temperature changes. In addition, an easy-to-operate user interface is also one of the factors that need to be considered when purchasing, so that operators can quickly get started and perform tests.
• Reliability: The power management chip temperature test system should have high reliability and stability, be able to work continuously for a long time and maintain accurate temperature control. When purchasing, you should consider choosing a brand and equipment that has undergone strict quality control to ensure its performance and reliability.
• After-sales service: Choose a supplier that provides comprehensive after-sales service to ensure that you can receive timely solutions and technical support when encountering problems during use. In addition, suppliers should provide equipment maintenance and regular calibration services to ensure the accuracy and reliability of the equipment.
• Cost-effectiveness: When purchasing a power management chip temperature test system, cost-effectiveness needs to be considered. Choose equipment that fits your budget while ensuring it meets your testing needs and offers high performance and reliability.

In short, when purchasing a power management chip temperature test system, you need to consider the above points comprehensively to ensure that the purchased equipment can meet the testing needs and has high performance and reliability. At the same time, it is also very important to choose a supplier that provides after-sales service.

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