Refrigeratori industriali LNEYA Fornitore -
Thermal Chuck or Thermal Plate/Thermal Control Unit
MD -75℃～225℃- Precisione della temperatura±0.1℃
- Potenza di riscaldamento-60°C to +25°C: 2 min 0°C to +25°C: 2 min +25°C to +220°C: 6 min
- Potenza di raffreddamento220°C to +25°C: 2 min +25°C to -60°C: 6 min
- Source Power2,8KW
- Flat ShapeRound/Square
Quick temperature change control chuck
-75℃ to 225°C
|
Modello |
MD-708 |
MD-712 |
MDL-708 |
|
Temperatura. Intervallo |
-75℃～225℃ |
-75℃～225℃ |
-75℃～225℃ |
|
Precisione del controllo della temperatura |
±0.1℃ |
±0.1℃ |
±0.1℃ |
|
temperature uniformity |
±1℃ |
±1℃ |
±1℃ |
|
Flatness |
±50um |
±50um |
±50um |
|
Tablet Size |
200mm diameter disc |
300mm diameter disc |
150mm*200mm |
|
Host and card cable |
2.5m (other lengths can be customized) |
||
|
Flat surface treatment |
Electroplated nickel (optional gold plating) |
||
|
Heat Up |
-60°C to +25°C: 2 min 0°C to +25°C: 2 min +25°C to +220°C: 6 min |
||
|
Cool Down |
220°C to +25°C: 2 min +25°C to -60°C: 6 min |
||
|
Sistema di controllo |
PLC controller, heating feed-forward PID fuzzy algorithm, cooling electronic expansion valve PID adjustment control cooling capacity |
||
|
Display and Record |
7-inch color touch screen, record temperature curve |
||
|
Comunicazione |
Interfaccia Ethernet Protocollo TCP/IP |
||
|
Refrigeration Compressors |
Taikang |
||
|
Alimentazione |
220V 50/60HZ 2.8KW |
220V 50/60HZ 4.5KW |
220V 50/60HZ 2.8KW |
|
Host size mm |
550×650×370 |
550×650×370 |
550×650×370 |
Descrizione del prodotto
MD’s greatest innovation in thermal testing is the series of thermally controlled chucks, which are mainly used for performance testing, modeling, process development, design defect or IC failure analysis of semiconductor wafers. It can realize rapid temperature change and precisely control the temperature. The system itself has its own refrigerator, which avoids the consumption of liquid nitrogen, carbon dioxide, etc., and each system includes a chuck and a cold and hot control unit.
The inside of the plate adopts the direct evaporation method of refrigerant, which greatly improves the heat exchange efficiency and the heat exchange power per unit area of the plate compared with the liquid cooling method.
Rapid cooling/heating rates up to 25°C/min
Built-in refrigerator to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Programmable automation, temperature stability +/-0.1℃
Controller provides touch screen and remote interface to precisely control and monitor equipment temperature
Display test status – real-time data
Thermal Chuck MD series provides an open flat surface working platform, rapid temperature rise and fall, and constant temperature control, which can be used for testing RF devices and high-density power devices (IGBTSAND MOSFETS), and can also be used for rapid cooling of laboratory flat panels (plasma, biological products, batteries), etc.
E-mail: sales@cnzlj.com
WhatsApp: 086 13912479193
Il precedente: YQH 0℃~-75℃
Raccomandazioni correlate
-
The difference between direct contact liquid cooling and cold plate liquid cooling technology
421The cold plate liquid cooling technology is an implementation method in which the heat of the heating components is indirectly transferred to the cooling liquid enclosed in the circulating pipeline through the cold plate, and the heat is...
Visualizza i dettagli -
Serie di riscaldamento a raffreddamento diretto KRY
1078Rated test conditions: dry bulb temperature 20℃; wet bulb temperature 16℃. Inlet water temperature 20℃; outlet water temperature 25℃. The data in this table is for reference only. Please refer to the unit name...
Visualizza i dettagli -
LTS -40℃~80℃
659It is widely used in the semiconductor manufacturing process to control the temperature of the reaction chamber, the temperature of the heat sink, and the temperature control of the non-flammable fluid of the heat transfer...
Visualizza i dettagli -
Serie AI
864* 1. Widely used in high and low temperature testing of semiconductor equipment.Cold and heat source of electronic equipment at high temperature and low temperature; 2. Independent refrigeration circulating air ...
Visualizza i dettagli -
LTS -60℃~80℃
633It is widely used in the semiconductor manufacturing process to control the temperature of the reaction chamber, the temperature of the heat sink, and the temperature control of the non-flammable fluid of the heat transfer med...
Visualizza i dettagli -
LTS -80℃~80℃
620It is widely used in the semiconductor manufacturing process to control the temperature of the reaction chamber, the temperature of the heat sink, and the temperature control of the non-flammable fluid of the heat transfer me...
Visualizza i dettagli
Invia per la consultazione
Vi risponderemo entro 24 ore