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MD -75℃~225℃
MD -75℃~225℃
MD -75℃~225℃

Thermal Chuck or Thermal Plate/Thermal Control Unit

MD -75℃~225℃
  • Precisione della temperatura±0.1℃
  • Potenza di riscaldamento-60°C to +25°C: 2 min 0°C to +25°C: 2 min +25°C to +220°C: 6 min
  • Potenza di raffreddamento220°C to +25°C: 2 min +25°C to -60°C: 6 min
  • Source Power2,8KW
  • Flat ShapeRound/Square

Quick temperature change control chuck

Modello

MD-708

MD-712

MDL-708

Temperatura. Intervallo

-75℃~225℃

-75℃~225℃

-75℃~225℃

Precisione del controllo della temperatura

±0.1℃

±0.1℃

±0.1℃

temperature uniformity

±1℃

±1℃

±1℃

Flatness

±50um

±50um

±50um

Tablet Size

200mm diameter disc

300mm diameter disc

150mm*200mm

Host and card cable

2.5m (other lengths can be customized)

Flat surface treatment

Electroplated nickel (optional gold plating)

Heat Up

-60°C to +25°C: 2 min

0°C to +25°C: 2 min

+25°C to +220°C: 6 min

Cool Down

220°C to +25°C: 2 min

+25°C to -60°C: 6 min

Sistema di controllo

PLC controller, heating feed-forward PID fuzzy algorithm, cooling electronic expansion valve PID adjustment control cooling capacity

Display and Record

7-inch color touch screen, record temperature curve

Comunicazione

Interfaccia Ethernet Protocollo TCP/IP

Refrigeration Compressors

Taikang

Alimentazione

220V 50/60HZ 2.8KW

220V 50/60HZ 4.5KW

220V 50/60HZ 2.8KW

Host size mm

550×650×370

550×650×370

550×650×370

MD’s greatest innovation in thermal testing is the series of thermally controlled chucks, which are mainly used for performance testing, modeling, process development, design defect or IC failure analysis of semiconductor wafers. It can realize rapid temperature change and precisely control the temperature. The system itself has its own refrigerator, which avoids the consumption of liquid nitrogen, carbon dioxide, etc., and each system includes a chuck and a cold and hot control unit.

The inside of the plate adopts the direct evaporation method of refrigerant, which greatly improves the heat exchange efficiency and the heat exchange power per unit area of the plate compared with the liquid cooling method.

Thermal Chuck MD series provides an open flat surface working platform, rapid temperature rise and fall, and constant temperature control, which can be used for testing RF devices and high-density power devices (IGBTSAND MOSFETS), and can also be used for rapid cooling of laboratory flat panels (plasma, biological products, batteries), etc.

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