If LNEYA® multi channel chillers do not meet your application
we can tailor a suitable solution for you.
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Temp range -45℃~90℃ Temp accuracy ±0.1℃
Multi channel chillers Video
Modello | FLTZ-203W-2T | |
Pipeline | channel 1 | channel 2 |
Intervallo di temperatura | -20℃~+90℃ | -20℃~+90℃ |
Capacità di raffreddamento | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | |
Capacità di riscaldamento | 4kW@-10℃ | 4kW@-10℃ |
Heat conducting medium flow rate | 2kW | 2kW |
Heat conducting medium connection size | 20L/min 0.5MPa | 20L/min 0.5MPa |
Heat transfer interface | ZG3/4 | ZG3/4 |
Ambient temperature | 10~35℃ | 10~35℃ |
Ambient humidity | 30~70% | 30~70% |
Temperatura dell'acqua di raffreddamento | 15~20℃ | 15~20℃ |
Cooling water flow rate | 20L/min | 20L/min |
Peso | 400 kg | |
Dimensioni cm | 50*90*160 |
Modello | FLTZ-406W/ETCU-015W | |
Pipeline | channel 1 | channel 2 |
Intervallo di temperatura | -45℃~+40℃ | +10℃~+80℃ |
Capacità di raffreddamento | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | |
Capacità di riscaldamento | 11kW@-20℃ 5kW@-40℃ |
13kW@+10℃ |
Heat conducting medium flow rate | 2kW | 6kW |
Heat conducting medium connection size | 17L/min 0.7MPa | 17L/min 0.7MPa |
Heat transfer interface | ZG3/4 | ZG3/4 |
Ambient temperature | 10~35℃ | 10~35℃ |
Ambient humidity | 30~70% | 30~70% |
Temperatura dell'acqua di raffreddamento | 15~20℃ | 15~20℃ |
Cooling water flow rate | 40L/min | 20L/min |
Peso | 550kg | |
Dimensioni cm | 60*100*185 |
Modello | FLTZ-203W/2T dual system | FLTZ-305W/2T dual system | FLTZ-406W/2T dual system | |||
Intervallo di temperatura | -20℃~90℃ | -30℃~90℃ | -45℃~90℃ | |||
Precisione del controllo della temperatura | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | |||||
Heat conducting medium flow rate | 15~45l/min 6bar max | |||||
Capacità di riscaldamento | 2,5kW | 2,5kW | 2,5kW | 2,5kW | 3,5kW | 3,5kW |
Capacità di raffreddamento | 3kW @-15℃ | 3kW @-15℃ | 5kW @-15℃ | 5kW @-15℃ | 2.5kW @ -35℃ | 2.5kW @ -35℃ |
Volume del fluido di circolazione interno | 5L | 5L | 8L | 8L | 8L | 8L |
Interfaccia acqua di raffreddamento | 50L/min at20℃ | 600L/min at20℃ | 50L/min at20℃ |
Modello | FLTZ-203W/ETCU-008W | ||
Pipeline | channel 1 | channel 2 | channel 3 |
Intervallo di temperatura | -10℃~+60℃ | +30℃~+80℃ | -10℃~+80℃ |
Temperature stability | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | ||
Capacità di raffreddamento | 4kW@-10℃/21kW@+20℃ | 6 kW@+30℃ | 3kW@-10℃ |
Capacità di riscaldamento | 4kW | 4.5+6kW | 3kW |
Heat conducting medium flow rate | 17L/min 0.7MPa | 17L/min 0.7MPa | 17L/min 0.7MPa |
Heat conducting medium connection size | ZG3/4 | ZG3/4 | ZG3/4 |
Ambient temperature | 10~35 ℃ | 10~35 ℃ | 10~35 ℃ |
Ambient humidity | 30~70% | 30~70% | 30~70% |
Cooling water flow rate | 15~20℃ | 15~20℃ | 15~20℃ |
Temperatura dell'acqua di raffreddamento | 30L/min@15~20℃ | 15L/min@15~20℃ | 15L/min@15~20℃ |
Interruttore automatico | 100A | ||
Peso | 600kg | ||
Dimensioni cm | 60*100*170 |
Modello | FLT-215W/ETCU-015W/ETCU-008W | ||
Pipeline | channel 1 | channel 2 | channel 3 |
Intervallo di temperatura | -20℃~+50℃ | +30℃~+100℃ | +30℃~+40℃ |
Temperature stability | ±0.1℃(Customizable temperature control accuracy of ±0.01°C.) | ||
Capacità di raffreddamento | 15kW@-10℃ | 13kW@PCW+15℃ | 8kW@PCW+10℃ |
Capacità di riscaldamento | 2kW | 6kW | Pump Heat Loss |
Heat conducting medium flow rate | 30L/min 0.85MPa | 30L/min 0.85MPa | 20L/min 0.8MPa |
Heat conducting medium connection size | ZG3/4 | ZG3/4 | ZG3/4 |
Ambient temperature | 10~35 ℃ | 10~35 ℃ | 10~35 ℃ |
Ambient humidity | 30~70% | 30~70% | 30~70% |
Cooling water flow rate | 15~20℃ | 15~20℃ | 15~20℃ |
Temperatura dell'acqua di raffreddamento | 30L/min@15~20℃ | 15L/min@15~20℃ | 15L/min@15~20℃ |
Interruttore automatico | 75A | ||
Peso | 600kg | ||
Dimensioni cm | 60*100*170 |
Multi-channel Chiller‘s Applications
FLTZ multi-channel chillers are widely used in the semiconductor industry due to their advantages such as precise temperature control, independent circuit management, and rapid cooling. The application scenarios of semiconductor chillers include wafer manufacturing, packaging testing, photolithography, etching, CVD/PVD deposition, cleaning processes, etc.
The high-energy particle beam generated during ion implantation can cause local high temperatures. The process chiller can quickly remove heat to prevent thermal damage to the wafer.
During plasma etching (RIE, ICP, etc.), the chamber and electrodes need to be strictly temperature controlled to ensure etching uniformity. The chiller can provide a stable temperature environment for etching equipment and reduce process deviations
In the packaging process of BGA, CSP, FCBGA, etc., the temperature control of welding and packaging materials affects reliability
CVD (such as LPCVD, PECVD) and PVD (such as sputtering coating) are used for thin film deposition, and the temperature control of the chamber and substrate affects the quality of the film.
The exposure system, optical lenses, laser light sources, and mask plates of the photolithography machine require precise temperature control to ensure pattern accuracy.
Used to help maintain deionized water within a specific temperature range to remove photoresist residues, metal contamination and particulate matter.
Why do you need FLTZ multi channel chillers?
Perché scegliere LNEYA®?
If LNEYA® multi channel chillers do not meet your application
we can tailor a suitable solution for you.
Contatta LNEYA
Inviateci la vostra richiesta e vi contatteremo entro 24 ore.
WeChat/Telefono
18914253067
86 13912479193
Indirizzo e-mail
sales@cnzlj.com