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Multi channel chillers

Dual channel chiller or Three channel chiller for semiconductor industry

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  • There are two or more channels with the same/different specifications in one housing;
  • The temperature of two fluid channel systems can be controlled separately by one host;
  • One power supply system realizes the temperature control of 2 channels, reducing the wiring work time;
  • By controlling the variable frequency compressor, variable frequency fan, and electronic expansion valve at the same time, it can still maintain good temperature stability when the heat load fluctuates;
  • Use a pump without mechanical seal. There is no need to regularly check the pump for leakage and replace the mechanical seal.

Dual channel chillers
Three channel chillers
ETCU Heat exchange chillers
ModelloFLTZ-203W-2T
Pipelinechannel 1channel 2
Intervallo di temperatura -20℃~+90℃ -20℃~+90℃
Capacità di raffreddamento4kW@-10℃4kW@-10℃
Heating capacity2kW2kW
Heat conducting medium flow rate20L/min@0.5MPa20L/min@0.5MPa
Heat conducting medium connection sizeZG3/4ZG3/4
Ambient temperature10~35℃10~35℃
Ambient humidity30~70%30~70%
Temperatura dell'acqua di raffreddamento15~20℃15~20℃
Cooling water flow rate20L/min20L/min
Circuit breaker30A
Peso400 kg
Dimensioni cm500*900*1600
Process temperature controlThe remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

ModelloFLTZ-406W/ETCU-015W
Pipelinechannel 1channel 2
Intervallo di temperatura -45℃~+40℃+10℃~+80℃
Capacità di raffreddamento11kW@-20℃
5kW@-40℃
13kW@+10℃
Heating capacity2kW6kW
Heat conducting medium flow rate17L/min@0.7MPa17L/min@0.7MPa
Heat conducting medium connection sizeZG3/4ZG3/4
Ambient temperature10~35℃10~35℃
Ambient humidity30~70%30~70%
Temperatura dell'acqua di raffreddamento15~20℃15~20℃
Cooling water flow rate40L/min20L/min
Circuit breaker80A
Peso550kg
Dimensioni cm600*1000*1850
Process temperature controlThe remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

ModelloFLTZ-203W/ETCU-008W
Pipelinechannel 1channel 2channel 3
Intervallo di temperatura -10℃~+60℃+30℃~+80℃-10℃~+80℃
Capacità di raffreddamento4kW@-10℃/21kW@+20℃6 kW@+30℃3kW@-10℃
Heating capacity4kW4.5+6kW3kW
Heat conducting medium flow rate17L/min@0.7MPa17L/min@0.7MPa17L/min@0.7MPa
Heat conducting medium connection sizeZG3/4ZG3/4ZG3/4
Ambient temperature10~35 ℃10~35 ℃10~35 ℃
Ambient humidity30~70%30~70%30~70%
Cooling water flow rate15~20℃15~20℃15~20℃
Temperatura dell'acqua di raffreddamento30L/min@15~20℃15L/min@15~20℃15L/min@15~20℃
Circuit breaker100A
Peso600kg
Dimensioni cm600*1000*1700
Process temperature controlThe remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

ModelloFLTZ-203W/2T dual systemFLTZ-305W/2T  dual systemFLTZ-406W/2T dual system
Intervallo di temperatura-20℃~90℃ -30℃~90℃-45℃~90℃
Heat conducting medium flow rate15~45l/min 6bar max
Heating capacity2,5kW2,5kW2,5kW2,5kW3,5kW3,5kW
Capacità di raffreddamento3kW at-15℃3kW at-15℃5kW at-15℃5kW at-15℃2.5kW at -35℃2.5kW at -35℃
Volume del fluido di circolazione interno5L5L8L8L8L8L
Volume del vaso di espansione15L25L25L
Heat-conducting mediumFluorinated liquid, antifreeze, thermal conductive silicone oil, etc
RefrigeranteR404A/ R448
Heat-conducting medium interfaceZG3/4
Interfaccia acqua di raffreddamentoZG3/4
Interfaccia acqua di raffreddamento50L/min at20℃600L/min at20℃50L/min at20℃
PotenzaThree phase 220V/Three phase 400V/Three phase 460V
Process temperature controlLa temperatura del bersaglio remoto può essere controllata combinando il modello autocostruito con l'albero libero autocostruito.
algoritmo e algoritmo a cascata

ModelloFLT-215W/ETCU-015W/ETCU-008W
Pipelinechannel 1channel 2channel 3
Intervallo di temperatura-20℃~+50℃+30℃~+100℃+30℃~+40℃
Capacità di raffreddamento15kW@-10℃13kW@PCW+15℃8kW@PCW+10℃
Heating capacity2kW6kWPump Heat Loss
Heat conducting medium flow rate30L/min@0.85MPa30L/min@0.85MPa20L/min@0.8MPa
Heat conducting medium connection sizeZG3/4ZG3/4ZG3/4
Ambient temperature10~35 ℃10~35 ℃10~35 ℃
Ambient humidity30~70%30~70%30~70%
Cooling water flow rate15~20℃15~20℃15~20℃
Temperatura dell'acqua di raffreddamento30L/min@15~20℃15L/min@15~20℃15L/min@15~20℃
Circuit breaker75A
Peso600kg
Dimensioni cm600*1000*1700
Process temperature controlThe remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

ModelloETCU-005WETCU-015WETCU-030WETCU-050WETCU-100WETCU-200WETCU-300W
Intervallo di temperaturaCooling water temperature +5℃~90℃
Precisione del controllo della temperatura±0,05℃(Temperatura di uscita a stato stazionario)
Temperatura dell'acqua di raffreddamento7℃~30℃ Cooling water flow is controlled by Siemens/Honeywell regulating valves
Capacità di raffreddamento5kW15kW30kW50kW100kW200kW300kW
Test conditions: When the maximum circulation amount, the temperature difference between
the temperature control temperature and the cooling water temperature is 15℃
Pompa di circolazione7~20L/min 5bar15~40L/min 5bar20~60L/min 5bar40~110L/min 5bar150~250L/min 5bar250~500L/min 5bar400~650L/min 5bar
Volume del serbatoio5L10L20L30L60L120L240L
Dimensioni cm480*750*390480*750*390480*750*500CustomizationCustomizationCustomizationCustomization
Process temperature controlThe remote target temperature can be controlled by combining the self created model free self
 built tree algorithm and cascade algorithm

FLTZ multi-channel chillers are widely used in the semiconductor industry due to their advantages such as precise temperature control, independent circuit management, and rapid cooling. The application scenarios of semiconductor chillers include wafer manufacturing, packaging testing, photolithography, etching, CVD/PVD deposition, cleaning processes, etc.

Ion implantation

The high-energy particle beam generated during ion implantation can cause local high temperatures. The process chiller can quickly remove heat to prevent thermal damage to the wafer.

Etching

During plasma etching (RIE, ICP, etc.), the chamber and electrodes need to be strictly temperature controlled to ensure etching uniformity. The chiller can provide a stable temperature environment for etching equipment and reduce process deviations

Chip packaging

In the packaging process of BGA, CSP, FCBGA, etc., the temperature control of welding and packaging materials affects reliability

PVD/CVD

CVD (such as LPCVD, PECVD) and PVD (such as sputtering coating) are used for thin film deposition, and the temperature control of the chamber and substrate affects the quality of the film.

Photolithography

The exposure system, optical lenses, laser light sources, and mask plates of the photolithography machine require precise temperature control to ensure pattern accuracy.

Wet cleaning

Used to help maintain deionized water within a specific temperature range to remove photoresist residues, metal contamination and particulate matter.

If you need independent temperature control for multiple different equipment or processes, and don’t want to buy multiple independent chillers, then FLTZ multi-channel chillers are a very ideal choice.

With the help of the Internet, we have built a global consulting, sales and service network. We have served more than 30,000 customers worldwide and have more than 90 patents.

Our chillers have been selected by more than 100 university laboratory projects around the world and exported to more than 20 countries. We have agents in various European countries and regions such as Singapore, Malaysia, Japan, South Korea, Qatar, Middle Eastern countries, Australia, the Netherlands, Spain and the United States.

We can customize it for you. For example, cooling capacity, power supply, size
We can customize the voltage and phase of the chiller according to your needs.

Generally, our multi-channel water dispenser for you includes two types: dual channel and triple channel,
If you have other channel requirements, you can contact us for customization.

LNEYA not only provides temperature control systems for semiconductor chillers, but also offers gas coolers for testing in downstream processes, and even provides temperature chambers.

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