Refrigeratori industriali LNEYA Fornitore -
Processo di confezionamento e collaudo dei semiconduttori
LNEYA has rich experience in product research and development in the semiconductor packaging and testing industry, and its rich product line meets various temperature control needs in the industry.
Products include: FLTZ series high-precision chiller heaters, LT series refrigeration chillers, heat exchange and temperature control units ETCU, direct cooling machines ZLJ/ZLTZ, gas chillers AES/LQ/AI/AET/gas dryers, chamber test boxes and other products.
解决方案
SOLUTION
Il processo di confezionamento e collaudo dei semiconduttori è un anello fondamentale del processo di produzione dei semiconduttori, che comprende il collaudo dei wafer, il confezionamento dei chip e il collaudo post-confezionamento. Questo processo richiede non solo alta precisione e affidabilità, ma anche un rigoroso controllo della temperatura per garantire la qualità e le prestazioni del prodotto.
The typical packaging process is: dicing, mounting, bonding, plastic sealing, deburring, electroplating, printing, cutting and molding, appearance inspection, finished product testing, packaging and shipment.
Serie di conversione di frequenza FLTZ
—Temperature control accuracy ±0.05℃ (Outlet temperature steady state)
-90~+100℃, mainly used for precise temperature control in semiconductor production and testing processes. The company applies a variety of algorithms in the system to achieve fast system response and high control accuracy.
Serie LT a frequenza fissa
—Compressor cascade refrigeration, temp as low as -80℃
LNEYA Refrigeration Chiller temperature range is from -80℃ to -5℃, using secondary supercooling technology, rapid cooling. Strong product reliability and excellent performance.
Refrigeratore a scambio termico ETCU
—No compressor
ETCU compressor-free heat exchange system, the system can be universal expansion tank, condenser, cooling water system, etc., which can effectively reduce the size of equipment and reduce the number of operating steps.
Rapid Temp Change Test Chamber
—Fast temperature change, fast heating and cooling rate
Applicable to environmental stress screening test, through environmental stress screening of products, accelerate the discovery of product design defects and improve product reliability. Many industries have realized that high-speed temperature change cycle testing can identify unreliable systems that have already entered the production test stage. It has become a standard method for improving quality and effectively extending the normal working life of products.
Two-door Impact Test Chamber
—Impact test, low temp -40~0℃ high temp +60~+150℃
The test basket is mobile during high and low temperature impact tests. The high and low temperature impact conversion is mainly completed by moving the test basket up and down in the high temperature zone and the low temperature zone. The impact recovery time of the two-box type is shorter than that of the three-box type.
Camera di prova walk-in
—Temperature control range: -80℃～+150℃
È adatto per le prove di bassa temperatura, alta temperatura, variazioni di alta e bassa temperatura, calore umido costante, calore umido alternato ad alta e bassa temperatura e altre prove di macchine complete o componenti di grandi dimensioni. Le dimensioni e le funzioni dello studio possono essere modificate in base alle esigenze dell'utente. Il box a blocchi ha una bella forma e un design scientifico del condotto dell'aria per soddisfare le esigenze dei diversi clienti.
Serie LQ
—Low temperature can reach -110℃
Applied to cool down the gas (non-corrosive): when dry compressed air, nitrogen, argon and other normal temperature gases are introduced into the LQ series equipment, the outgoing gas can reach the target low temperature and be supplied to the components or heat exchangers to be tested.
AES系列热流仪
—升降温速率快，+150℃〜-55℃低于10S
射流式⾼低温冲击测试机给芯⽚、模块、集成电路板、电⼦元器件等提供精确且快速的环境温度。是对产品电性能测试、失效分析、可靠性评估的仪器设备。
AET系列气体快速温变测试机
—可选择控制出口气体温度和工艺目标过程温度
压缩空⽓进⼊⽓体快速温变测试机，内置有⼲燥器，预先把⽓体⼲燥到露点温度-70度以下，进⾏制冷加热控温输出稳定流量压⼒恒温的⽓体，对⽬标对象进⾏控温（如各类控温卡盘、腔体环境、热承板、料梭、腔体、电⼦元件等），可根据远程卡盘上的温度传感器进⾏⼯艺过程控温，⾃动调节输出⽓体的温度。
